- SPU: AL-NO46-7w5zr5e7[N3]
- Model: Solder Paste SolderPaste
- Brand:XG-50
- Processing and customization: No
- Viscosity:0.2
- Granularity:25-45
- Alloy composition: lead + tin
- Activity:99
- Type: canned
- Cleaning angle: around solder joints
- Melting point: 183℃
- Type: tin paste
- Working temperature: above 200
- Scope of application: mobile phone chip repair, computer or home appliance chip patch repair, BGA special products
- Specifications: XGSP30 (medium temperature 20g)
- Specifications: XGSP50 (medium temperature 42g)
- Specifications: XGSP80 (medium temperature 60g)
- Specifications: XGSP200 (medium temperature 200g)
- Specifications: XGSP500 (medium temperature 500g)
- Specifications:XG-50
- Specifications:XGSP40 (35g)
- Specifications:XG-30 (16g)
- Specifications:XG-Z40
Warranty Information
The goods can be returned to the customer without reason within 15 days from the date of receipt.The return and exchange of goods shall be approved by the merchant in the store.
Procurement and delivery
Delivery time: the goods in stock will be delivered within 1-3 working days after you place an order and pay, and you will receive our notice after delivery.
payment
Credit card payment (express payment) is a new payment method launched by the third-party payment platform in conjunction with major banks.It is one of the safest and easiest payment methods.Users do not need to open online banking in advance, and can complete rapid payment by entering card face, mobile phone dynamic password and other information.Quick payment allows all kinds of bank card users to make online payment conveniently without opening online banking.
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