Product details
Original Hong Kong repair man solder paste XGSP80 leaded normal temperature melting point 183 degrees medium and low temperature solder paste
$ 3.10
sales volume:8
Product description
Product description
Model: Solder Paste SolderPaste
Brand:XG-50
Processing and customization: No
Viscosity:0.2
Granularity:25-45
Alloy composition: lead + tin
Activity:99
Type: canned
Cleaning angle: around solder joints
Melting point: 183℃
Type: tin paste
Working temperature: above 200
Scope of application: mobile phone chip repair, computer or home appliance chip patch repair, BGA special products
Specifications: XGSP30 (medium temperature 20g)
Specifications: XGSP50 (medium temperature 42g)
Specifications: XGSP80 (medium temperature 60g)
Specifications: XGSP200 (medium temperature 200g)
Specifications: XGSP500 (medium temperature 500g)
Specifications:XG-50
Specifications:XGSP40 (35g)
Specifications:XG-30 (16g)
Specifications:XG-Z40
Product description
No data available
$
3.10
colour
XGSP30 (medium temperature 20g)
XGSP50 (medium temperature 42g)
XGSP80 (medium temperature 60g)
XGSP200 (medium temperature 200g)
XGSP500 (medium temperature 500g)
XG-50
XGSP40 (35g)
XG-30 (16g)
XG-Z40
size
One size fits all
number
-
+
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